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产品描述EVG®850 TB临时键合机FeaturesOpen adhesive platformVarious carriers (silicon, glass, sapphire, etc…)Bridge tool capability for different substrate sizesAvailable with multiple load port options and combinationsRecipe controlled systemReal time monitoring and recording of all relevant process parametersFully integrated SECS/GEM interfaceOptional integrated inline metrology module for automated feedback loopTechnical DataWafer diameter (substrate size)Up to 300 mm, oversized carrier possibleDifferent substrate / carrier combinationsConfigurationCoat moduleBake module with multiple hot platesAlign module with optical or mechanical alignmentBond moduleOptionsInline MetrologyID readingHigh topography wafer handlingWarped wafer handlingEVG®850 DB 解键合机FeaturesReliable handling of thinned, bowed and warped wafers with and without topographyAutomated cleaning of debonded waferRecipe controlled systemReal time monitoring and recording of all relevant process parametersFully integrated SECS/GEM interface in automated toolsBridge tool capability for different substrate sizesModular tool layout → throughput-optimized depending on specific processTechnical DataWafer diameter (substrate size)Up to 300 mmUp to 12“ film frameConfigurationDebond moduleClean moduleFilm frame mounterOptionsID readingVarious output formatsHigh topography wafer handlingWarped wafer handling
EVG®850 TB临时键合机
Features
Open adhesive platform
Various carriers (silicon, glass, sapphire, etc…)
Bridge tool capability for different substrate sizes
Available with multiple load port options and combinations
Recipe controlled system
Real time monitoring and recording of all relevant process parameters
Fully integrated SECS/GEM interface
Optional integrated inline metrology module for automated feedback loop
Technical Data
Warped wafer handling
EVG®850 DB 解键合机
Reliable handling of thinned, bowed and warped wafers with and without topography
Automated cleaning of debonded wafer
Fully integrated SECS/GEM interface in automated tools
Modular tool layout → throughput-optimized depending on specific process
晶圆临时键合机解键合机 ,EVG®850 TB DB
晶圆临时键合机解键合机 信息由上海螣芯电子科技有限公司为您提供,如您想了解更多关于 晶圆临时键合机解键合机 报价、型号、参数等信息,欢迎来电或留言咨询。
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