The 7120 / 7130 family of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility.
With different models to choose from, each optimized for a specific
range of applications, the 7120 / 7130 Series covers the widest range of
applications, offering the lowest possible cost of ownership while
providing the most advanced dicing technology available.
The 7120 / 7130 Dicing System is an industry leading platform designed for a variety of applications such as:
Ceramic Substrates & Capacitors
Glass
Automotive Sensors
PZT
Glass on Silicon
LED & LED on PCB Packages
Package Singulation (BGA, QFN)
Opto-electronic Components
SAW Filters
Sensors & MEMS
LTCC
IC Wafers
7120 / 7130 Series Features & Options:
Extra Large Area Dicing (7100 XLA)
Large Area
Tilting Spindle
Dressing Stationfor diamonds exposure and clogging prevention
7120 / 7130 Series Advantages:
2” and 4” spindle dicing systems
A full range of automatic vision capabilities
Advanced hardware platform for high reliability and low maintenance
Heavy Duty, cast-iron base structure for superior precision and accuracy