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EVG510晶圆键合机
参考价：￥680000
品牌：EVG 产地：奥地利 型号：EVG®510 样本：来电或留言获取样本
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参数
| 产地类别：进口 | 供应商性质：生产商 |
产品介绍
产品描述 Features Unique pressure and temperature uniformity Compatible with EVG mechanical and optical aligners Flexible design and configurations for research and piloting Form single chips to wafers Various processes (eutectic, solder, TLP, direct bonding) Optional turbopump (<1E-5 mbar) Upgradeable for anodic bonding Open chamber design for easy conversion and maintenance Production compatible High throughput with fast heating and pumping specifications High yield through automatic wedge compensation Open chamber design for fast conversion and maintenance Smallest footprint for a 200 mm bonding system: 0.8 m2 Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems Technical DataMax contact force 10, 20, 60 kN Heater size 150 mm 200 mm Minimum substrate dimension single chips 100 mm Vacuum Standard: 0.1 mbar Optional: 1E-5 mbar Max. temperature Standard: 550 °C Optional: 650 °C Single chips processing Yes Bond chuck system / Alignment system 150 mm heater: EVG®610, EVG®620, EVG®6200 200 mm heater: EVG®6200, SmartView® NT Active water cooling For bottom side Power supply for anodic bonding Max. voltage: 2 kV Max. current: 50 mA Loading chamber Manual 
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