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产品描述FeaturesUnique pressure and temperature uniformityCompatible with EVG mechanical and optical alignersFlexible design and configurations for research and pilotingForm single chips to wafersVarious processes (eutectic, solder, TLP, direct bonding)Optional turbopump (<1E-5 mbar)Upgradeable for anodic bondingOpen chamber design for easy conversion and maintenanceProduction compatibleHigh throughput with fast heating and pumping specificationsHigh yield through automatic wedge compensationOpen chamber design for fast conversion and maintenanceSmallest footprint for a 200 mm bonding system: 0.8 m2Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systemsTechnical DataMax contact force10, 20, 60 kNHeater size150 mm200 mmMinimum substrate dimensionsingle chips100 mmVacuumStandard: 0.1 mbarOptional: 1E-5 mbarMax. temperatureStandard: 550 °COptional: 650 °CSingle chips processingYesBond chuck system / Alignment system150 mm heater: EVG®610, EVG®620, EVG®6200200 mm heater: EVG®6200, SmartView® NTActive water coolingFor bottom sidePower supply for anodic bondingMax. voltage: 2 kVMax. current: 50 mALoading chamberManual
Features
Unique pressure and temperature uniformity
Compatible with EVG mechanical and optical aligners
Flexible design and configurations for research and piloting
Form single chips to wafers
Various processes (eutectic, solder, TLP, direct bonding)
Optional turbopump (<1E-5 mbar)
Upgradeable for anodic bonding
Open chamber design for easy conversion and maintenance
Production compatible
High throughput with fast heating and pumping specifications
High yield through automatic wedge compensation
Open chamber design for fast conversion and maintenance
Smallest footprint for a 200 mm bonding system: 0.8 m2
Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems
Technical Data
EVG510晶圆键合机 ,EVG®510
EVG510晶圆键合机 信息由上海螣芯电子科技有限公司为您提供,如您想了解更多关于 EVG510晶圆键合机 报价、型号、参数等信息,欢迎来电或留言咨询。
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