400-6699-117转1000
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上海螣芯电子科技有限公司
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| 参考报价： | ￥680000 RMB（人民币） | 型号： | EVG®510 |
| 品牌： | EVG | 产地： | 奥地利 |
| 关注度： | 70 | 信息完整度： |  |
| 样本： | 典型用户： | 暂无 |
400-6699-117转1000
产品描述 Features Unique pressure and temperature uniformity Compatible with EVG mechanical and optical aligners Flexible design and configurations for research and piloting Form single chips to wafers Various processes (eutectic, solder, TLP, direct bonding) Optional turbopump (<1E-5 mbar) Upgradeable for anodic bonding Open chamber design for easy conversion and maintenance Production compatible High throughput with fast heating and pumping specifications High yield through automatic wedge compensation Open chamber design for fast conversion and maintenance Smallest footprint for a 200 mm bonding system: 0.8 m2 Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems Technical DataMax contact force 10, 20, 60 kN Heater size 150 mm 200 mm Minimum substrate dimension single chips 100 mm Vacuum Standard: 0.1 mbar Optional: 1E-5 mbar Max. temperature Standard: 550 °C Optional: 650 °C Single chips processing Yes Bond chuck system / Alignment system 150 mm heater: EVG®610, EVG®620, EVG®6200 200 mm heater: EVG®6200, SmartView® NT Active water cooling For bottom side Power supply for anodic bonding Max. voltage: 2 kV Max. current: 50 mA Loading chamber Manual 
EVG510晶圆键合机 信息由上海螣芯电子科技有限公司为您提供，如您想了解更多关于 EVG510晶圆键合机 报价、型号、参数等信息，欢迎来电或留言咨询。
注：该产品未在中华人民共和国食品药品监督管理部门申请医疗器械注册和备案，不可用于临床诊断或治疗等相关用途
