The plasma source in this series can be incorporated into a vacuum chamber, generating high-density plasma. This product can also be used as a plasma-assisted deposition unit, making it possible to improve the properties of the film for applications such as optical thin films, protective and function films.. 这一系列的等离子体源可以被纳入一个真空室，产生高密度等离子体。本产品还可以用作等离子体辅助沉积单元，从而提高应用如光学薄膜的膜性能，防护功能的电影。 The product can also be used for the treatment of plasma, such as surface modification and cleaning, while the large-current, low-voltage plasma enables ionization and exciting gas molecule and evaporated particles, with the possibility of reactive deposition.. 该产品也可用于等离子体处理，如表面改性和清洗，而大电流，低压等离子体的电离和激发使气体分子和蒸发的粒子，随着反应沉积的可能性。 Finally, the high-rate deposition to a large area is possible because high-density plasma can also be generated in a mass space. zei后，由于高密度等离子体也可以在大众空间产生的高速率沉积大面积是可能的。
BS-80011BPG High-power Plasma Source for high-density plasma
The plasma source are incorporated into a vacuum chamber and generate high-density plasma. The plasma source can be used as Plasma Assisted Deposition (Ion Plating) and it is possible to improve film properties for optical thin films, protective films and function films. And can also be used for plasma treatment such as cleaning and surface modification.
Low-voltage and large-current plasma enables to ionize and excite gas molecule and evaporated particles.
Reactive deposition is possible, especially suitable for a film oxidation promotion.
High-density plasma can be generated in a mass space, thus high-rate deposition to a large area is possible.
Retrofit to an existing vacuum chamber is possible.
Improvement of film density, refractive index 提高薄膜密度，折射率
Production of environmentally stable films 环境稳定性膜
Low wavelength shift 波长漂移小
Low optical absorption (promotion of film oxidation) 光学吸附少
Improvement of film adhesion 提高膜粘附性
Improvement of surface roughness 提高表面强度
Control of film stress 控制膜压力
Maximum plasma output zei大等离子体输出： 6kW (160V, 38A)
Operating pressure 操控压力： 1×10-2 to 1×10-1Pa (Ar, O2, N2 atmosphere)
Discharge gas(Ar) 放电气体（氩气）： 8 to 20mL/min
Cooling water 冷却水流速： 7 to 10L/min
Beam method电子束方法 ：反射电子束和辐射电子束可选selectable from Reflection-beam and Irradiation-beam