LatticeGear 背划式划片系统 FlipScribe 100

The FlexScribe, scribing tool, is LatticeGear’s latest sample preparation solution. It compliments the patented FlipScribe and LatticeAx scribing and cleaving solutions.
 The Flexscribe Station is a topside scriber, superfast, clean, simple station for downsizing by scribing. With a single platform, it scribes large samples up to 200 mm to samples down to 5 mm without restrictions on shape or thickness. Scribe a wide variety of crystalline and amorphous materials.

Benefits：
> Can scribe samples with irregular edges of any shape or thickness
> Single tool handles wafers and samples from 200 mm to 5 mm
> Makes straight, repeatable, scribes regardless of user
> Scribes glass, silicon, III-V, sapphire and other crystalline and amorphous material

Features:
> Scribes thin and think samples of any shape
> Placed on a self-healing cleaving mat, samples are protected from damage 
> Cleaving mat is ruled to scribe samples of specific dimensions
> Easy to keep clean, clean with IPA or water
> No power, no computers, no maintenance

Minimal mechanical and thermal damage
Thin specimens (>10 µm) or thick (<1 cm)
Rapidly cuts disks, rods, or rectangular specimens
Automatic termination

FlexScribe划片工具是LatticeGear最新的样品制备解决方案。它与获得专利的FlipScribe和LatticeAx划线和切割解决方案相得益彰。

Flexscribe工作站是一个顶部划线器，超快速、清洁、简单，可通过划线缩小尺寸。使用单个平台，它可以在不受形状或厚度限制的情况下，将最大200 mm的大样本划线到最小5 mm的样本。书写各种各样的晶体和非晶体材料。

优点：

>可以用任何形状或厚度的不规则边缘划线样品

>单个工具可处理200 mm至5 mm的晶圆和样品

>无论用户如何，都能做出笔直、可重复的划线

>划线玻璃、硅、III-V族、蓝宝石和其他晶体和非晶材料

特征：

>划得薄，可以针对任何形状的样品

>将样品放置在自愈裂垫上，保护样品免受损坏

>切割垫用于切割特定尺寸的样品

>易于保持清洁，使用IPA或水清洁

>没有电源，没有电脑，没有维护

最小的机械和热损伤

薄试样（>10µm）或厚试样（<1 cm）

快速切割圆盘、棒或矩形试样

自动终止

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