LatticeGear 背划式划片系统 FlipScribe 100

The FlexScribe, scribing tool, is LatticeGear’s latest sample preparation solution. It compliments the patented FlipScribe and LatticeAx scribing and cleaving solutions.
 The Flexscribe Station is a topside scriber, superfast, clean, simple station for downsizing by scribing. With a single platform, it scribes large samples up to 200 mm to samples down to 5 mm without restrictions on shape or thickness. Scribe a wide variety of crystalline and amorphous materials.

Benefits：
> Can scribe samples with irregular edges of any shape or thickness
> Single tool handles wafers and samples from 200 mm to 5 mm
> Makes straight, repeatable, scribes regardless of user
> Scribes glass, silicon, III-V, sapphire and other crystalline and amorphous material

Features:
> Scribes thin and think samples of any shape
> Placed on a self-healing cleaving mat, samples are protected from damage 
> Cleaving mat is ruled to scribe samples of specific dimensions
> Easy to keep clean, clean with IPA or water
> No power, no computers, no maintenance

Minimal mechanical and thermal damage
Thin specimens (>10 µm) or thick (<1 cm)
Rapidly cuts disks, rods, or rectangular specimens
Automatic termination

FlexScribe划片工具是LatticeGear最新的样品制备解决方案。它与获得专利的FlipScribe和LatticeAx划线和切割解决方案相得益彰。

Flexscribe工作站是一个顶部划线器，超快速、清洁、简单，可通过划线缩小尺寸。使用单个平台，它可以在不受形状或厚度限制的情况下，将最大200 mm的大样本划线到最小5 mm的样本。书写各种各样的晶体和非晶体材料。

优点：

>可以用任何形状或厚度的不规则边缘划线样品

>单个工具可处理200 mm至5 mm的晶圆和样品

>无论用户如何，都能做出笔直、可重复的划线

>划线玻璃、硅、III-V族、蓝宝石和其他晶体和非晶材料

特征：

>划得薄，可以针对任何形状的样品

>将样品放置在自愈裂垫上，保护样品免受损坏

>切割垫用于切割特定尺寸的样品

>易于保持清洁，使用IPA或水清洁

>没有电源，没有电脑，没有维护

最小的机械和热损伤

薄试样（>10µm）或厚试样（<1 cm）

快速切割圆盘、棒或矩形试样

自动终止

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注：该产品未在中华人民共和国食品药品监督管理部门申请医疗器械注册和备案，不可用于临床诊断或治疗等相关用途