PR1-12000A Positive Resist PR1-12000A is a positive tone photoresist designed for 365 or 436 nm wavelength exposure, using tools such as wafer steppers, scanning projection aligners, proximity printers and contact printers. PR1-12000A excels in applications when superior adhesion is required. Use of adhesion promoters, such as HMDS is not recommended with PR1-12000A. These are the advantages of PR1-12000A over other resists: - superior resolution capability - fast photospeed - substrate adhesion which is superior to that of any commercial positive resist - ease of removal after RIE process - shelf life exceeding 1 year at room temperature storage. The formulation and processing of PR1-12000A were designed with regard to occupational and environmental safety. The principal solvent in PR1-12000A is 1-methoxy-2-propanol and development of PR1-12000A is accomplished in a basic water solution. Properties ♦ Solids content (%): 40-45 ♦ Principal solvent: 1-methoxy-2-propanol ♦ Appearance: light yellow liquid ♦ Coating characteristic: very uniform, striation free ♦ Film thickness information: Coating spin speed, 40 s spin (rpm) Film thickness after 100°C oven bake for 15 min (nm) 800 23500-24500 2300 14800-15200 3000 11800-12200 ♦ Sensitivity (mJ/cm² for 1 μm thick film): 365 nm exposure wavelength: 70 436 nm exposure wavelength: 40 ♦ Guaranteed shelf life at 25°C storage (years): 1 Processing 1 Application of resist by spin coating at selected spin speed for 40 s. 2 Application of Edge Bead Remover EBR1 to bottom and edge of the coated wafer for 10 s, until 5 s before completion of spin cycle. 3 100°C bake in a bake oven for 30 minutes or 120ºC hotplate bake for 180 s. 4 Resist exposure with a tool emitting 365, 406 or 436 nm wavelengths. 5 Resist development in Resist Developer RD6 by spray or immersion.