New Software, Control Hardware, Dry Process Pump, Dry Loadlock Pump and Heater Assembly.
技术参数:
Wafer capacity: Three two inch wafers. Load lock: Loadlock chamber with hepa filter loading area. Heater: Single zone graphite heater Temperature control: Temperature monitor single point T/C, Eurotherm controller, single point Sekidenko Pyrometer. Group III MO sources: TMGa - 2 units; TMIn - 2 units; TMAl -2 units Group V hydride sources: AsH3 -2 lines; PH3 -2 line. Dopants MO: CP2Mg -1 unit, DeZn - 1 unit Dopants Hydride: H2/SiH4 - 2 lines Neslab bath: 6 units. Piezocon: Single channel concentration monitor for TMIn expandable to Four channels (option). Pump: EBARA A30; Exhaust system: particle filter/ housing; Phosphorus trap; P-trap automatic regeneration system (option). Gas Monitoring: CM4 4 point toxic gasmonitor.(integration option) Software: Windows based control software.