The Elite Etch Cu ESD 7200 model incorporates critical ESD protection circuitry, thereby eliminating the potential for incremental ESD damage to fragile packages during decapsulation. In traditional non-conductive PTFE, a charge may build up on the inner surface of the acid line tubing and any residual electrical charge cannot be neutralized. If the charge exceeds the dielectric strength of the PTFE, dielectric breakdown occurs. ESD hazards associated with PTFE are eliminated in this system by the use of electrically dissipative PTFE.
The Elite Etch Cu ESD 7200 is equipped with a conductive ram nose connected to a high impedance resistor network to aid in ESD mitigation during decapsulation. The plastic encapsulated IC itself is of particular concern to justify working with a static-free environment. The solution is an electrically isolated yet dissipative ram nose assembly combined with the electrically functional PTFE. These components ensure that the process of decapsulation eliminates all ESD risks within the part being opened. The system is equipped with two ESD panel mounted sockets and circuitry for the attachment of ESD tweezers and a wrist strap. The wrist strap can be worn to mitigate ESD problems when handling a decapsulated package- including removal of the part from the decapsulator, rinsing, or drying.
Specifications
Etcher Unit
Height: 300 mm (13 in)
Width: 190 mm (7.5 in)
Depth: 305 mm (12 in)
Bottle Assembly
Height: 254 mm (10 in)
Width: 280 mm (11 in)
Depth: 127 mm (5 in)
Weight
Approx. 16 kg (35 lb)
Power Source
90 to 250 VAC, 50 to 60 Hz (4 amp)
Acid temp. range
10° to 250° C
Acid temp. set point
1° C ± 1% of setting
Etch cavity (up to)
22 mm x 22 mm (30 mm diagonal)
Choice of Acids
fuming nitric acids, mixed fuming nitric and sulfuric acids, or fuming/concentrated sulfuric acid