The ETD-900M ion sputtering apparatus has beautiful appearance and exquisite workmanship.
Magnetron sputtering is a kind of Physical Vapor Deposition (PVD). The general sputtering method can be used to prepare materials such as metal, semiconductor, insulator and so on. It has the advantages of simple equipment, easy control, large coating area and strong adhesion. The magnetron sputtering method has achieved high speed, low temperature and low damage. Because of the high velocity sputtering at low pressure, the ionization rate of gas must be increased effectively. Magnetron sputtering improves the plasma density by increasing the plasma density by introducing magnetic field on the cathode surface and confining the charged particles by magnetic field.