IC半导体LED封装检测解决方案WB&DB焊线AOI检测设备
型号:F241/F251
主要特征 :
1. 可选的5面和6面检查
2. 2.5D深度技术
3. 模块化且灵活
4. 64位操作系统
5. 至强处理器
6. 吞吐量从20,000上升到50,000上升
7. 相机分辨率范围从75 fps时的5百万像素到66fps时的12百万像素
应用范围:
1. 晶圆切割后进行检查以检测表面缺陷。
2. 封装分离后进行检查,以检测封装,标记,引线和电镀缺陷。
TTVISION自动光学检测设备的检测方式
*2D
*2.5D
*True 3D (Z5D)
F251
Wirebond AOI Machine
Features
3D Profiling Technology
Inspects Wire bond, Die & Epoxy Defects
Inspects Gold. Aluminum. Copper and Silver Wires
Measures Ball. Wedge. Stitch and Loop Parameters
Minimum Overkill & Underkill
Modular end Scalable Design
Cost Effective
High Throughput
F241
AOI Standard Configuration
Modular Design for Max Flexibility
Standardized Platform
Common Spare Parts
2D AOI技术规格 |
|
·Onload /Offload |
|
Number of Magazines | 2-7 units |
Substrate Size | 30(W) x 150(L) - 200(W) x 300(L)mm |
Handling |
|
Camera Indexing | High Speed Servo driven XY Gantry |
Substrate Indexing | Micro-Step Stepper driven Conveyor |
·Inspection Hardware |
|
Camera Resolution | 12MP Color |
Lighting | Multi Channel LED |
Optics | Low Distortion Macro Lens |
Controller | PC-based |
·Software |
|
Inspection Software | TTVISION © |
·Operating System | MS Windows 64 bit OS |
·Reject Handling |
|
Electronic Mapping |
|
Defect Classification | 99 Categories |
IC半导体LED封装检测WB,F241/F251
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